MX-6 Thermal PastePerformance for CPU Graphics Cards laptops High Thermal Conductivity Long Durability, with High Adhesion, for Effective Heat Dissipation

Spec:

Item Type: Thermal Conductive Glue
Material: Silicone Grease
Thermal Conductivity: >0.671W/M.K
Single Net Weight: Approx. 5g / 0.2oz
Viscosity: 1.5MPA


Package List:
10 x Thermal Conductive Glue

Note:
Do not use thermal conductive adhesive between CPU and heat sink

Features of MX-6 Thermal PastePerformance for CPU Graphics Cards laptops High Thermal Conductivity Long Durability, with High Adhesion, for Effective Heat Dissipation

[Effectively Disperse Heat] TheNT-H1 Thermal Paste is designed to effectively disperse heat from the chipset to the heat sink, ensuring optimal performance and longevity. | [Excellent Insulation] Made of silicone grease material, this thermal glue provides excellent insulation and resistance to acid, water, ozone and oxidation, ensuring safe and reliable operation. | [Strong Adhesion] With strong adhesion, this GPU thermal paste securely attaches the heat sink to the chipset, providing a stable and efficient heat dissipation solution. | [Wide Application] Suitable for various industries, including MOSFET, LED, heat sink, north and south bridge, graphics card, and more. It is an essential component for heat dissipation in electrical appliances and instruments. | [Portable and Reliable] TheNT-H1 Thermal Paste comes in a lightweight and portable size, making it easy to store and carry. It is compatible with all heat sinks without fixed clips, ensuring convenience and reliability.

Specification of MX-6 Thermal PastePerformance for CPU Graphics Cards laptops High Thermal Conductivity Long Durability, with High Adhesion, for Effective Heat Dissipation

Product Details
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